Lead-Free Soldering: Surface Mount Technology

Course Code: SLS
Delivery: Online
Languages: English

Audience:

A modular interactive multimedia learning program intended for process engineers and technicians involved in the implementation, operation, and monitoring of lead-free soldering SMT processes.

Objectives:

Participants successfully completing the program will be able to:

  • Explain the impact of lead-free materials on the SMT reflow soldering process.
  • Identify solder paste specifications and materials considerations.
  • Explain reliability, acceptance criteria, and cosmetics.
  • Explain flux specifications, no-clean fluxes, high solids, water based.
  • Describe PCBs, surface finish, component lead-finish and packaging, DFM.
  • Explain temperature compatibility, Moisture Sensitivity.
  • Explain solder joint defects in reflow.
  • Explain the benefits and indicators for the use of Nitrogen.
  • Describe profiling for lead-free, measurement techniques.
  • Explain cleaning after soldering, cosmetics, ionic residues, inspection standards.

Qualification and Certification Testing

LearnTech® training incorporates interactive learning checks throughout the instructional sequences. Certification tests are criterion-referenced and module-based with feedback on every response for enhanced learning. Administrative access to dates and scores of tests, certifications, and re-certifications is compliant with ISO quality-standards requirements.

Standard Complient

This course applies JEDEC Standard JESD97 for Identification of Lead(Pb) Free Assemblies, Components, and Devices.

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