Lead-Free Soldering: Rework

Course Code: SLR
Delivery: Online
Languages: English

Audience:

A modular interactive multimedia learning program for process engineers, managers, and senior operators involved in the implementation and management of lead-free electronic assembly processes.

Objectives:

Participants successfully completing the program will be able to:

  • Explain concepts of rework and lead-free rework.
  • Identify areas of rework affected by transition to lead-free.
  • Identify defects more likely to occur with lead-free assembly.
  • Explain the appearance of acceptable tin/lead and lead-free joints.
  • Describe the care of soldering equipment and demands of lead-free.
  • Identify solder types based on labelling and naming conventions.
  • Explain the role of flux and the impact of lead-free.
  • Explain the impact of lead-free on board laminates and finishes.
  • Describe removal, cleaning, and replacement for through-hole, SMT.
  • Explain the cleaning procedures after reworking lead-free.
  • Describe moisture control in lead-free rework.
  • Explain challenges in reworking SMT area-array devices.
  • Describe optical and X-ray Inspection for area-array devices.
  • Explain temperature issues for area-array devices with lead-free.

Qualification and Certification Testing

LearnTech® training incorporates interactive learning checks throughout the instructional sequences. Certification tests are criterion-referenced and module-based with feedback on every response for enhanced learning. Administrative access to dates and scores of tests, certifications, and re-certifications is compliant with ISO quality-standards requirements.

Standard Complient

This course applies JEDEC Standard JESD97 for Identification of Lead(Pb) Free Assemblies, Components, and Devices.

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